Carrier, carrier leadframe, and light emitting device and method for manufacturing same

ABSTRACT

A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present disclosure is part of a divisional application of U.S.patent application Ser. No. 14/720,230, which was filed on May 22, 2015claiming the priority benefit of Taiwan Patent Application No.103118060, filed on May 23, 2014, and Taiwan Patent Application No.104103527, filed on Feb. 3, 2015. The aforementioned applications areincorporated herein by reference in their entirety.

TECHNICAL FIELD

The present disclosure relates to a carrier leadframe and a lightemitting device made from the carrier leadframe. More particularly, thepresent disclosure relates to a carrier leadframe for receiving a lightemitting diode (LED) chip and a light emitting device made from theleadframe.

BACKGROUND

Unless otherwise indicated herein, approaches described in this sectionare not prior art to the claims listed below and are not admitted to beprior art by inclusion in this section.

Light emitting diodes (LEDs) have such advantages as a long servicelife, a small volume, high resistance to shock, low heat generation andlow power consumption, so they have been widely used as indicators orlight sources in household appliances and various other appliances. Inrecent years, LEDs have developed towards multicolor and highbrightness, so applications thereof have been extended to large-sizedoutdoor signboards, traffic signal lamps and related fields. In thefuture, it is even possible that the LEDs become mainstream illuminationlight sources having both power-saving and environmental protectionfunctions. To impart the LEDs with good reliability, most of the LEDsare subjected to a packaging process to form durable light emittingdevices.

In recent years, a dicing-type carrier leadframe has been developed bymanufacturers in the art to which the present disclosure belongs.Specifically, a plastic body is molded on a metal sheet material, then adie bonding process, a wire bonding process and an encapsulation processare performed, and then the metal sheet material and the plastic bodyare diced away simultaneously to form individual light emitting devicesthat are separate from each other. However, a large amount of plasticand metal dusts tend to be produced during the dicing process, whichseriously pollute the surfaces of the final products and thus degradethe reliability of the products. Additionally, this process does notallow for a light-on test prior to the encapsulation process, andmeasurements can only be made after the products are singulated.However, the final products that have been singulated are piledrandomly, and machine measurements on them can only be made aftersurface orientation and direction adjustment. This requires use ofadditional instruments and is time consuming.

SUMMARY

The following summary is for illustrative purpose only and is notintended to be limiting in any way. That is, the following summary isprovided to introduce concepts, highlights, benefits and advantages ofthe novel and non-obvious techniques described herein. Selectimplementations are further described below in the detailed description.Thus, the following summary is not intended to identify essentialfeatures of the claimed subject matter, nor is it intended for use indetermining the scope of the claimed subject matter.

In view of the aforesaid problems, the present invention provides acarrier and a carrier leadframe, which has at least one carrier that isseparated in advance and mechanically engaged with the leadframe,thereby facilitating quick release of material after die bonding, wirebonding and encapsulation. Besides, in the carrier leadframe of thepresent invention, each carrier is electrically isolated from othercarriers, so after LEDs are die bonded and wire bonded to the carriers,the electric measurement can be performed before the release ofmaterial. Furthermore, a light emitting device made from the carrierleadframe is also provided in the present invention, and with theadvantages of the aforesaid carrier leadframe, the production speed andyield of the light emitting device can be greatly improved.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of the present disclosure. The drawings illustrateimplementations of the disclosure and, together with the description,serve to explain the principles of the disclosure. It is appreciablethat the drawings are not necessarily in scale as some components may beshown to be out of proportion than the size in actual implementation inorder to clearly illustrate the concept of the present disclosure.

FIG. 1 is a partial schematic view of an embodiment of a carrierleadframe according to the present disclosure.

FIG. 2 is a partial schematic view of a conductive sheet used in thecarrier leadframe of FIG. 1.

FIG. 3 is a partial schematic view of the carrier leadframe of FIG. 1after a plastic body is formed.

FIG. 4 and FIG. 4A are partial schematic views of the carrier leadframeof FIG. 1 after the residual material is removed.

FIG. 5 is a partial schematic view of another embodiment of the carrierleadframe according to the present disclosure.

FIG. 6 is a top view of a light emitting device according to anembodiment of the present disclosure.

FIG. 7 is a top view of a light emitting device according to anotherembodiment of the present disclosure.

FIG. 8 is a top view of a light emitting device according to a furtherembodiment of the present disclosure.

FIG. 9 is a top view of a light emitting device according to yet anotherembodiment of the present disclosure.

FIG. 10 is a top view of a light emitting device according to yet afurther embodiment of the present disclosure.

FIG. 11 is a top view of a light emitting device according to stillanother embodiment of the present disclosure.

FIG. 12A to FIG. 12D are respectively a top view, a cross-sectional viewtaken along the front-to-back direction, a cross-sectional view takenalong the left-to-right direction, and a partially enlarged view of acarrier leadframe according to an embodiment of the present disclosure.

FIG. 13A to FIG. 16 are schematic views illustrating steps of a methodfor manufacturing a carrier leadframe according to an embodiment of thepresent disclosure.

FIG. 17A to FIG. 17D are respectively a top view, a cross-sectional viewtaken along the front-to-back direction, a cross-sectional view takenalong the left-to-right direction, and a partially enlarged view of acarrier leadframe according to an embodiment of the present disclosure.

FIG. 18A to FIG. 22 are schematic views illustrating steps of a methodfor manufacturing a carrier leadframe according to an embodiment of thepresent disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

A carrier leadframe of the present invention comprises a frame body anda carrier, and the carrier includes a housing and at least one electrodeportion. In the present invention, the frame body includes at least onesupporting portion and is mechanically engaged with the carrier so thatthe carrier is supported on the frame body. In a specific embodiment ofthe present invention, the housing may have a concave portion matingwith the supporting portion, and the carrier is supported on the framebody through the engagement between the supporting portion and theconcave portion. The position of the concave portion is not particularlylimited in the present invention, and the concave portion may be locatedat a side surface or at the border between a bottom surface and the sidesurface of the carrier. The supporting portion goes deep into thecarrier or is only positioned on the bottom surface of the carrier witha half thereof being exposed outside.

FIG. 1 is a partial schematic view of an embodiment of a carrierleadframe according to the present disclosure. As shown in FIG. 1, acarrier leadframe 100 comprises a carrier 110 and a frame body 120, andthe carrier 110 comprises a housing 111 and two electrode portions 112.The frame body 120 comprises a plurality of supporting portions 121. Asshown in FIG. 1, the frame body 120 beneath the carrier leadframe 100comprises four supporting portions 121, and four concave portions areformed at the border between the side surfaces and the bottom surface ofthe housing 111 (corresponding to positions of the supporting portions121) so that each of the four supporting portions 121 is positioned onthe bottom surface of the carrier 110 with a half thereof being exposedoutside. In an embodiment, the carrier 110 further comprises areflection concave cup to expose a part of each of the electrodeportions 112. The electrode portion 112 extends outwardly from thereflection concave cup through the housing 111 to the outside.

The frame body 120 may also have a runner area 122 and a side portion123, and the runner area 122 is disposed on the side portion 123. Therunner area 122 is a through area that allows a plastic body 150 (asshown in FIG. 3) to be described later to flow therethrough, and thesupporting portion 121 is disposed also on the side portion 123.

Additionally, each of the electrode portions 112 may also be formed withpinholes, grooves (linear slits on the surface of the electrode portion)and steps in the present disclosure. The mechanical binding forcebetween the housing and the electrode portion of the carrier can beincreased due to the pinholes, the grooves and the steps. As shown inFIG. 1, each of the two electrode portions 112 in the carrier 110comprises two pinholes 141 and three grooves 143, and steps 142 areprovided on edges of the two electrode portions 112 that are surroundedby the housing 111, thereby increasing the binding strength between thehousing 111 and the electrode portions 112.

Each carrier in the carrier leadframe of the present disclosure issupported on the frame body via the mechanical engagement between theconcave portion and the supporting portion, and the electrode portionsof different carriers are electrically isolated from each other. Thus,after the die bonding process, the wire bonding process and theencapsulation process subsequently performed on the light emittingdevices, the electric measurement can be made on the light emittingdevices that have not been singulated (i.e., the light emitting devicesthat are still supported on the frame body in a regular way). Since thelight emitting devices are arranged regularly, equipment and timerequired for surface orientation and direction adjustment are eliminatedand the production speed of the light emitting devices can be greatlyimproved.

The carrier leadframe of the present disclosure may be manufactured inthe following way. First, a conductive sheet is provided. The conductivesheet comprises a frame body, at least one void area and at least oneextending portion, and the frame body comprises at least one supportingportion. Then, a plastic body is formed on the conductive sheet to coverat least a part of the extending portion and at least a part of thesupporting portion and to fill at least a part of the void area.Subsequently, the part of the extending portion exposed outside thehousing and a part of the plastic body filled within the void area arerespectively removed so as to form the carrier. In particular, after thetwo removing steps, the housing of the carrier is formed by theremaining plastic body, and the electrode portion of the carrier isformed by the extending portion remaining on the plastic body.

Hereinafter, the manufacturing process of the carrier leadframe 100 ofFIG. 1 will be detailed with reference to FIG. 2 to FIG. 4. First, aconductive sheet 160 as shown in FIG. 2 is provided. The conductivesheet 160 comprises a frame body 120, a plurality of void areas 130 anda plurality of extending portions 140. The frame body 120 also comprisesa plurality of supporting portions 121, and each of the extendingportions 140 comprises a plurality of pinholes 141, grooves 143 andsteps 142. Finally, the part of each of the extending portions 140exposed outside the housing is removed to form the carrier leadframe 100of FIG. 1.

In the present disclosure, the conductive sheet may be made of a metalsheet, including a pure metal sheet, an alloy sheet, and a metalcomposite sheet, and the composite sheet is preferably a metal sheetcladded with a conductive layer having a relatively high resistance tooxidation or a relatively high solder binding force (e.g., asilver-plated copper sheet, or the like). The frame body, the extendingportion and the void portion are formed in an appropriate way. When theconductive sheet is made of a metal sheet, the frame body, the extendingportion and the void portion may be preferably formed through a stampingprocess; however, they may also be formed through a dicing process or amold casting process. Moreover, if the conductive sheet has insufficientconductivity, a conductive layer (not shown) may be formed on theconductive sheet after the conductive sheet is provided (theconductivity of the conductive layer is higher than that of theconductive sheet) so as to increase the reliability of the subsequenttest. The material of the conductive layer may include materials havinghigh conductivity (e.g., silver, or the like).

After the conductive sheet is provided, a plastic body is then formed onthe conductive sheet. The way in which the plastic body is formed is notlimited. For Example, the plastic body may be formed through transfermolding, injection molding, etc. The material of the plastic body is notlimited. For example, it may be selected from plastic materials commonlyused in this industry, e.g., epoxy compositions, silicon compositions,polyphthalamide compositions, or polyethylene terephthalatecompositions. In a specific embodiment of the present disclosure, theplastic body is made of an epoxy composition through transfer molding.In another embodiment, the plastic body may be a thermosetting materialand may further comprise a reflective material, e.g., titanium dioxide(TiO2), zinc oxide (ZnO) or boron nitride (BN).

Next, a plastic body 150 is formed on the conductive sheet 160 as shownin FIG. 3. The plastic body 150 covers a part of each of the extendingportions 140 and completely covers all of the pinholes 141 and grooves143. The plastic body 150 also fills a part of the void area 130 (thepart of the void area 130 above and below the extending portion 140 isnot filled) and completely covers all of the supporting portions 121.The plastic body 150 also fills the runner area 122 and is formedintegrally with another adjacent plastic body 150.

Further speaking, during the formation of the plastic body 150 in thepresent disclosure, the material of the plastic body 150 will fill themold cavity of the mold and the void area. In this step, the housing 111and the residual material 151 are still held together. The scope of theresidual material 151 is defined depending on the subsequent applicationof the product. As shown in FIG. 3, what denoted by dotted lines is theresidual material 151 defined in this embodiment. Thereafter, thedefined residual material 151 is removed as shown in FIG. 4, therebyforming the housing 111 of the carrier 110.

If the runner area 122 is filled with the plastic body 150, the residualmaterial 151 may be removed in at least two steps, e.g., by firstlyremoving the residual material 151 filled in the runner area 122 andthen removing the residual material 151 filled in the void area 130 orvice versa. This can simplify the arrangement of knives for removing theresidual material 151 in each step so that the knives have sufficientdistances therebetween and desirable strength.

Finally, the part of each of the extending portions 140 exposed outsidethe housing 111 is removed to form the carrier leadframe 100 as shown inFIG. 1. Before the part of each of the extending portions 140 isremoved, the part of the frame body 120 at two sides of the runner area122 may be removed optionally with a knife of a length larger than thatof the runner area 122 so as to thoroughly remove the residual material151 possibly left in the runner area 122; thus, the damage to theelectrode portions 112 or the light emitting diode (LED) chips can beavoided by preventing the residual material 151 from falling off ontothe electrode portions 112 or the LED chips. After the part of the framebody 120 at the two sides of the runner area 122 is removed, the lengthof the runner area 122 is increased as shown in FIG. 4B.

Therefore, the manufacturing method of this embodiment may optionallyperform two or more removing steps on the conductive sheet 160 and mayalso perform two or more removing steps on the plastic body 150 (theresidual material 151).

In the present disclosure, the residual material 151 and parts of theextending portions 140 are removed separately. In particular, the orderin which the residual material 151 and the parts of the extendingportions 140 are removed is not particularly limited as long as they areseparately removed. For example, it may be that all the parts of theextending portions 140 are simultaneously removed after all the residualmaterial 151 is simultaneously removed, or all the residual material 151is removed after all the parts of the extending portions 140 aresimultaneously removed, or part of the residual material 151 and partsof the extending portions 140 are removed alternately in differentstages. The way in which the removing steps are performed is notlimited, and the removing steps may be accomplished for example througha dicing process or a stamping process but preferably be accomplishedthrough the stamping process. The stamping process is taken as anexample in the embodiments of the present disclosure.

The tools and the working strength can be adjusted depending on themechanical properties of the parts to be removed in the presentdisclosure. In particular, the respective removing steps can avoiddrawbacks resulting from removing different materials simultaneously,e.g., plane defects or damage to the removing tools (knives) due tonon-uniform stresses. Additionally, dusts of the plastic body tend to beproduced during the removal of the plastic body as compared to theremoval of the extending portion. The dusts can only be removed by astrong external force, e.g., through strong air blowing, shaking, orultrasonic waves. If the cleaning step is to be performed after theresidual material and the extending portion are simultaneously removed,it is possible that the bonding force between the carrier and the framebody is insufficient to avoid falling off of the material. Thus, in thepresent disclosure, the cleaning step (i.e., the cleaning of the plasticbody) is preferably performed after the residual material is removed andbefore the extending portion is removed. This can enhance the connectionstrength between the carrier and the leadframe by means of the extendingportion so as to avoid falling off of the material during the cleaningstep, and finally the extending portion is removed.

After the removing steps, at least one electrode portion cross sectionwill be formed on the electrode portion of the carrier, and a housingcross section will be formed by the residual material on the housing ofthe carrier. In the present disclosure, the electrode portion crosssection and the housing cross section may be located on a same surfaceor different surfaces of the carrier depending on the safetyspecification of the final product or depending on the customerrequirements. Further speaking, when the electrode portion cross sectionand the housing cross section are located on the same surface of thecarrier, the electrode portion cross section and the housing crosssection may be level with each other (i.e., form a flat surface) or maynot be level with each other (i.e., do not form a flat surface).

As shown in FIG. 1, the electrode portion 112 has a wing portion 112Aexposed outside the housing, and the wing portion 112A comprises acentral protruding area (or called central area) 112A1 and two outeredge areas (or called edge areas) 112A2. In the embodiment of FIG. 1,each of the edge areas 112A2 comprises an electrode portion crosssection, and the electrode portion cross sections are level with a partof the housing cross section 111A of the housing 111; and in this case,the carrier has a relatively flat appearance. However, as shown in FIG.5, the wing portion 112A of the electrode portion 112 comprises acentral protruding area 112A1 and two outer edge areas 112A2, and theelectrode portion cross section of the electrode portion 112 is notlevel with the housing cross section 111A of the housing 111; and inthis case, the electrode portion 112 has an additional lateral area thatcan increase the binding force with the solder so as to increase thecomponent bonding strength of the light emitting devices after thesubsequent component bonding process.

Moreover, in case where the conductive sheet is a metal composite sheetwith an antioxidant layer, a cross section uncovered with theantioxidant layer will be formed on the electrode portion cross section.In the present disclosure, the cross section uncovered with theantioxidant layer is preferably formed integrally with the central areaof the electrode portion. During the subsequent component bondingprocess, the solder may climb along the side surface of the wing portionand cover the side surface, and in this case, at least a part of thecross section uncovered with the antioxidant layer can be covered by thesolder to reduce the probability that the cross section portion isoxidized. Additionally, the cross section uncovered with the antioxidantlayer and the surface of the adjacent central area are at the same side,and preferably form a continuous surface so as to reduce sharp points orrough edges of the electrode portion. Otherwise, the sharp points orrough edges would cause wear of the subsequent processing machine, andwhat is worse, a charge accumulation effect might occur at the sharppoints or the rough edges to influence the reliability of the finallyproduct.

The present disclosure also provides a light emitting device made fromthe carrier leadframe of the present disclosure, and the light emittingdevice comprises a carrier, an LED chip and an encapsulant. The LED chipis carried within the carrier and covered by the encapsulant. Thematerial of the encapsulant in the present disclosure may be a plasticcomposite of epoxy resins or silicone. Moreover, the light emittingdevice of the present disclosure may optionally have fluorescentmaterials added into the encapsulant, and examples of the fluorescentmaterials include: aluminate fluorescent materials (e.g., doped yttriumaluminum oxide compounds, doped lutetium aluminum oxide compounds, dopedterbium aluminum oxide compounds, or combinations thereof), silicatefluorescent materials, sulfide fluorescent materials, oxynitridefluorescent materials, nitride fluorescent materials, fluoridefluorescent materials, or combinations thereof.

The light emitting device of the present disclosure may be manufacturedin the following way. First, a carrier leadframe as described above isprovided. Then, an LED chip is provided and die bonded and wire bondedinto the reflection concave cup of the carrier. Thereafter, thereflection concave cup is filled with an encapsulant so as toencapsulate the LED chip to form a light emitting device on the framebody. Finally, the light emitting device is separated from the framebody (i.e., the carrier is separated from the frame body for examplethrough extrusion) to form a separate light emitting device.

A plurality of LED chips may also be provided within the carrier in thepresent disclosure, and these LED chips can emit lights of the same ordifferent spectrums. After the LED chips are fixed, the wire bondingprocess may be performed to electrically connect the LED chips with theelectrode portion. Other electronic elements, e.g., a Zener diode or athermistor, may also be provided depending on requirements of the finalproduct.

Referring to FIG. 6, a top view of a light emitting device according toan embodiment of the present disclosure is shown therein. The wingportion 112A of the electrode portion 112 has a central area 112A1 andtwo edge areas 112A2, and the central area 112A1 protrudes from the twoedge areas 112A2. The wing portion 112A protrudes out of the housingcross section 111A of the housing 111 so that the central area 1112A1 ofthe wing portion 112A of the electrode portion 112 is not coplanar withthe housing cross section 111A of the housing 111. An interval D1 is thedistance between the central area of the wing portion 112A of theelectrode portion 112 and the inner side of the housing cross section111A of the housing 111, and the interval D1 is about 0.1 mm. Aninterval D2 is the distance between the central area 112A1 of the wingportion 112A of the electrode portion 112 and the outer side of the wingportion 112A of the housing 111 (i.e., the central area 112A1 of thewing portion 112A of the electrode portion 112 and the wing portion 112Aof the housing 111), and the interval D2 is about 0.05 mm.

Referring to FIG. 7, a top view of a light emitting device according toanother embodiment of the present disclosure is shown therein. The wingportion 112A of the electrode portion 112 has a central area 112A1 andtwo edge areas 112A2, and the wing portion 112A protrudes out of thehousing cross section 111A of the housing 111 so that the wing portion112A of the electrode portion 112 is not coplanar with the housing crosssection 111A of the housing 111. The interval D1 is the distance betweenthe central area of the wing portion 112A of the electrode portion 112and the inner side of the housing cross section 111A of the housing 111,and the interval D1 is about 0.1 mm. An interval D3 is the distancebetween the central area 112A1 of the wing portion 112A of the electrodeportion 112 and the outer side of the cross section 111A of the housing111, and the interval D3 is about 0.075 mm.

Referring to FIG. 8, a top view of a light emitting device according toa further embodiment of the present disclosure is shown therein. Thewing portion 112A of the electrode portion 112 has a central area 112A1and two edge areas 112A2, the central area 112A1 is recessed from thetwo edge areas 112A2, and the electrode portion cross sections of thetwo edge areas 112A2 are sloping surfaces. The wing portion 112A isrecessed into the cross section 111A of the housing 111 so that the wingportion 112A of the electrode portion 112 is not coplanar with the crosssection 111A of the housing 111. An interval D4 is the distance betweenthe outer side and the inner side of the cross section 111A of thehousing 111, and the interval D4 is about 0.05 mm. An interval D5 is thedistance between the central area of the wing portion 112A of theelectrode portion 112 and the outer side of the cross section 111A ofthe housing 111, and the interval D5 is about 0.025 mm.

Referring to FIG. 9, a top view of a light emitting device according toyet another embodiment of the present disclosure is shown therein. Thewing portion 112A of the electrode portion 112 has a central area 112A1and two edge areas 112A2, the central area 112A1 protrudes out of thetwo edge areas 112A2, and the electrode portion cross sections of thetwo edge areas 112A2 are sloping surfaces. The wing portion 112Aprotrudes out of the cross section 111A of the housing 111 so that thewing portion 112A of the electrode portion 112 is not coplanar with thecross section 111A of the housing 111.

Referring to FIG. 10, a top view of a light emitting device according toyet a further embodiment of the present disclosure is shown therein. Thewing portion 112A of the electrode portion 112 is a convex curvedsurface, i.e., the external surface of the central area and the outline(the electrode portion cross sections) of the edge areas together form acontinuous convex curved surface. The wing portion 112A protrudes out ofthe cross section 111A of the housing 111 so that the wing portion 112Aof the electrode portion 112 is not coplanar with the cross section 111Aof the housing 111.

Referring to FIG. 11, a top view of a light emitting device according tostill another embodiment of the present disclosure is shown therein. Thewing portion 112A of the electrode portion 112 is a concave curvedsurface, i.e., the external surface of the central area and the outline(the electrode portion cross sections) of the edge areas together form acontinuous concave curved surface. The wing portion 112A is recessedinto the cross section 111A of the housing 111 so that the wing portion112A of the electrode portion 112 is not coplanar with the cross section111A of the housing 111.

Referring to FIG. 12A to FIG. 12D, schematic views (i.e., a top view, across-sectional view taken along the front-to-back direction, across-sectional view taken along the left-to-right direction, and apartially enlarged view) of a carrier leadframe 100′ according to anembodiment of the present disclosure are shown therein. The carrierleadframe 100′ is similar to the aforesaid carrier leadframe 100. Thatis, the carrier leadframe 100′ also comprises a frame body 120 and acarrier 110, the frame body 120 comprises at least one supportingportion 121, the carrier 110 comprises a housing 111 and at least oneelectrode portion 112, and the housing 111 is mechanically engaged withthe frame body 120 via the supporting portion 121. Thus, for thetechnical contents of the aforesaid elements, reference may be made tothe counterparts of the carrier leadframe 100.

Preferably, the at least one electrode 112 may be two electrode portions112 spaced apart from each other to respectively serve as an anodeterminal and a cathode terminal of the carrier 110. The two electrodeportions 112 are surrounded by the frame body 120, i.e., the twoelectrode portions 112 are located within a space surrounded by theframe body 120 itself. The two electrode portions 112 may be separatedfrom the frame body 120 by at least one void area 130 so that the twoelectrode portions 112 will not make contact with the frame body 120 andthus be electrically isolated from the frame body 120.

The supporting portion 121 of the frame body 120 extends towards one ofthe two electrode portions 112, but will not make contact with theelectrode portion 112. In this embodiment, there are four supportingportions 121 that are distributed at two sides of the electrode portions112. The housing 111 may at least cover the supporting portions 121 andat least a part of the two electrode portions 112, and is at leastdisposed within a part of the void area 130. Thereby, the housing 111 ismechanically engaged with the frame body 120 via the supporting portions121, and the housing 111 is also mechanically engaged with the twoelectrode portions 112 so that the housing 111 and the two electrodeportions 112 can be held within the frame body 120 without falling offfrom the frame body 120.

The shape features of the electrode portions 112 will be furtherdescribed. Referring to FIG. 13A, each of the two electrode portions 112has a wing portion 112A and an inner side surface 112B that are disposedopposite to each other (i.e., disposed oppositely), the wing portion112A may be exposed outside the housing cross section 111A of thehousing 111 (reference may be made to the aforesaid relevantdescriptions of FIG. 6 to FIG. 11) and does not face the wing portion112A of another electrode portion 112. The inner side surfaces 1128 ofthe two electrode portions 112 may face each other, and at least a partof the two electrode portions 112 may be covered by the housing 111.

Each of the two electrode portions 112 further comprises two connectingsurfaces 112C disposed opposite to each other, and each of theconnecting surfaces 112C connects the wing portion 112A with the innerside surface 112B. That is, an edge (e.g., a front edge) of theconnecting surface 112C connects with an edge (i.e., a left edge) of thewing portion 112A, while another edge (e.g., a back edge) of theconnecting surface 112C connects with an edge (i.e., a left edge) of theinner side surface 112B. The wing portion 112A, the inner side surface112B and the two connecting surfaces 112C may not be flat surfaces. Thatis, the wing portion 112A, the inner side surface 112B and the twoconnecting surfaces 112C may be uneven or stepped surfaces.

Each of the two electrode portions 112 may further comprise at least onerecess 1121, and the recess 1121 may be disposed on the connectingsurface 112C so that the connecting surface 112C becomes an unevensurface. The recess 1121 can increase the contact area between theelectrode portion 112 and the housing 111 (the plastic body 150) andstrengthen the fastening effect between the electrode portion 112 andthe housing 111 by virtue of the corresponding geometric relationshipsso that the binding force between the electrode portion 112 and thehousing 111 is relatively strong. If there are a plurality of recesses1121, the recesses 1121 may be sized differently according to differentbinding forces required at different positions between the electrodeportion 112 and the housing 111.

The wing portion 112A, the inner side surface 112B and the twoconnecting surfaces 112C of the two electrode portions 112 may have theat least one void area 130 divided into a plurality of void areas 130,namely a gap 131, two first through grooves 132 and two second throughgrooves 133 in communication with each other. The gap 131 is disposedbetween the inner side surfaces 1128 of the two electrode portions 112,and the two first through grooves 132 are disposed along the twoconnecting surfaces 112C of the two electrode portions 112. That is, oneof the first through grooves 132 extends from an edge of one connectingsurface 112C of one electrode portion 112 to an edge of one connectingsurface 112C, which faces the same direction, of the other electrodeportion 112. The two first through grooves 132 are spaced apart fromeach other.

The two second through grooves 133 are disposed along the wing portions112A of the two electrode portions 112. That is, each of the secondthrough grooves 133 extends only along the wing portion 112A of one ofthe electrode portions 112. The two second through grooves 133 are alsospaced apart from each other.

The supporting portion 121 of the frame body 120 may extend towards oneof the two connecting surfaces 112C of the two electrode portions 112into one of the two first through grooves 132. The housing 111 may beoptionally disposed within the two first through grooves 132 and/or thegap 131. Additionally, the housing cross section 111A of the housing 111may at least comprise a curved surface, e.g., may have a rounded corner111R as shown in FIG. 12D. The housing cross section of the housing 111has the rounded corner that is connected to the electrode portion crosssection 112A2 of the electrode portion 112. The rounded corner 111R candisperse the impact force so that the rounded corner 111R is unlikely tobe broken or cracked by the impact force during a vibration test of thesingulated carrier 110. Moreover, in the embodiment as shown in FIG.12D, the housing cross section and the electrode portion cross sectiondo not form a flat surface, i.e., the housing cross section is not levelwith the electrode portion cross section.

According to the above descriptions, the carrier leadframe 100′ can alsoallow the electrode portions 112 of the carriers 110 to be electricallyisolated from each other. Thus, after the die bonding process, the wirebonding process and the encapsulation process are subsequently performedon the light emitting devices, the electric measurement can be directlyperformed on the light emitting devices that are not singulated, andthis greatly improves the production speed of the light emittingdevices. It shall be further appreciated that, the technical contents ofthe carrier leadframe 100′ may also be used as a reference for thecarrier leadframe 100.

An embodiment of the present disclosure further provides a method formanufacturing a carrier leadframe, which can at least manufacture theaforesaid carrier leadframe 100′. The method for manufacturing thecarrier leadframe 100′ is similar to the method for manufacturing theaforesaid carrier leadframe 100 and comprises the following steps.

Referring to FIG. 13A to FIG. 13C, first a conductive sheet 160 isprovided. The conductive sheet 160 comprises a frame body 120, and theframe body 120 comprises at least one supporting portion 121, at leastone void area 130 and at least one extending portion 140. The at leastone void area 130 may correspond to a gap 131, two first through grooves132 and two second through grooves 133 of the carrier leadframe 100′,but at this point, the two first through grooves 132 are not incommunication with the two second through grooves 133 yet. The at leastone extending portion 140 may correspond to the two electrode portions112 of the carrier leadframe 100′, but at this point, the two electrodeportions 112 have not been separated from the frame body 120 yet.

Referring to FIG. 14, then a plastic body 150 is formed in a secondstep. The plastic body 150 covers at least a part of the extendingportion 140 and at least a part of the supporting portion 121, and theplastic body 150 fills at least a part of the void area 130. Forexample, the plastic body 150 covers a part of the two electrodeportions 112 of the extending portion 140 and completely covers thesupporting portion 121, and the plastic body 150 fills the gap 131 andthe two first through grooves 132 of the void area 130 but does not fillthe second through grooves 133 of the void area 130. Furthermore, theplastic body 150 may make contact with the recess 1121 (as shown in FIG.13A) of the extending portion 140 so as to increase the contact areabetween the plastic body 150 and the extending portion 140.

Referring to FIG. 15, part of the plastic body 150 filled in the voidarea 130 is removed in a third step. That is, part of the plastic body150 filled in the two first through grooves 132 is removed. The plasticbody 150 to be removed is called the residual material 151 (as shown inFIG. 14), and the scope of the residual material 151 is defineddepending on the specific shape of the product. In this embodiment, theplastic body 150 filled in two end areas of the two first throughgrooves 132 is removed so that convex corners at four corners of theplastic body 150 are removed. The remaining plastic body 150 forms thehousing 111 of the carrier leadframe 100′.

Referring to FIG. 16, the part of the extending portion 140 exposedoutside the plastic body 150 is removed in a fourth step so that theremaining extending portion 140 is separated from the frame body 120. Inother words, the part of the extending portion 140 at two sides of thesecond through groove 133 (as shown in FIG. 15) will be removed in thisstep so that the second through groove 133 is in communication with thefirst through groove 132. The remaining extending portion 140 forms theelectrode portions 112 of the carrier leadframe 100′.

After the aforesaid steps, the carrier leadframe 100′ is formed. Fordetailed technical contents of the aforesaid steps, reference may bemade to the method for manufacturing the carrier leadframe 100. Forexample, a conductive layer may be firstly formed on the conductivesheet 160, the third step and the fourth step may be swapped with eachother, and the plastic body 150 may be cleaned before the fourth step.

Referring to FIG. 17A to FIG. 17D, schematic views (i.e., a top view, across-sectional view taken along the front-to-back direction, across-sectional view taken along the left-to-right direction, and apartially enlarged view) of a carrier leadframe 100″ according to anembodiment of the present disclosure are shown therein, where more thanone carrier leadframe 100″ are shown.

The carrier leadframe 100″ is similar to the aforesaid carrierleadframes 100 and 100′, so reference may be made to each other for thetechnical contents of the carrier leadframes 100″, 100, and 100′.However, it shall be appreciated that, the frame body 120 of the carrierleadframe 100″ has a side portion 123 and a runner area 122, and theside portion 123 may be commonly owned by the leadframes 120 of twocarrier leadframes 100″. In other words, the frame body 120 of the twocarrier leadframes 100″ may be formed integrally via the commonly ownedside portion 123. Moreover, the carriers 110 of the two carrierleadframes 100″ are separated from each other by the side portion 123.The runner area 122 is disposed in the side portion 123 and is incommunication with one of the two first through grooves 132 of eachcarrier leadframe 100″. It shall be further appreciated that, thehousing cross section 111A of the housing 111 may at least comprise acurved surface, e.g., may have a rounded corner 111R, and the roundedcorner 111R is connected to the side portion 123 of the frame body 120.Additionally, the electrode portion cross section of the electrodeportion 112 may also at least comprise a curved surface, and theaforesaid curved surfaces are not limited to a single curvature. Thatis, the outline of the edge areas of the electrode portion 112 is acurved line. The electrode portion cross section is not adjacent to therounded corner 111R. The impact force can be dispersed due to the curvedcross section. Meanwhile, in the embodiment as shown in FIG. 17D, thehousing cross section and the electrode portion cross section do notform a flat surface, i.e., the housing cross section is not level withthe electrode portion cross section.

In terms of the effect, the carrier leadframe 100″ can also allow theelectrode portions 112 of the carriers 110 to be electrically isolatedfrom each other. Thus, after the die bonding process, the wire bondingprocess and the encapsulation process are subsequently performed on thelight emitting devices, the electric measurement can be directlyperformed on the light emitting devices that are not singulated, andthis greatly improves the production speed of the light emittingdevices.

An embodiment of the present disclosure further provides a method formanufacturing a carrier leadframe, which can at least manufacture theaforesaid carrier leadframe 100″. The method for manufacturing thecarrier leadframe 100″ is similar to the method for manufacturing thecarrier leadframe 100′, so identical descriptions will be omitted orsimplified. The method for manufacturing the carrier leadframe 100″ maycomprise the following steps.

Referring to FIG. 18A to FIG. 18C, first a conductive sheet 160 isprovided. Two conductive sheets 160 are provided in this embodiment asan example. Each of the conductive sheets 160 comprises at least oneframe body 120, and the frame body 120 comprises at least one supportingportion 121, at least one side portion 123, at least one runner area122, at least one void area 130 and at least one extending portion 140.The runner area 122 is disposed on the side portion 123 and is incommunication with the void area 130.

Referring to FIG. 19, then a plastic body 150 is formed in a secondstep. The plastic body 150 covers at least a part of the extendingportion 140 and at least a part of the supporting portion 121 of eachconductive sheet 160, and the plastic body 150 fills at least a part ofthe void area 130. The plastic body 150 also fills the runner area 122;that is, the plastic body 150 passes through the runner area 122 tocover another conductive sheet 160. Moreover, the plastic body 150 makescontact with the recess 1121 (as shown in FIG. 18A) of the extendingportion 140 to increase the contact area between the plastic body 150and the extending portion 140.

Referring to FIG. 20, the plastic body 150 within the runner area 122 isremoved in a third step. The plastic body 150 can be removed in one stepor in several steps. Specifically, if the plastic body 150 is to beremoved in one step, then a knife of a length larger than that of therunner area 122 will be used to remove the part of the frame body 120 atthe two sides of the runner area 122 as well as the plastic body 150within the runner area 122 together. Thus, after the plastic body 150within the runner area 122 is removed, the runner area 122 will beslightly elongated.

If the plastic body 150 is to be removed in several steps, then first aknife of a length slightly smaller than that of the runner area 122 willbe used to remove part of the plastic body 150 within the runner area122, and then another knife is used to scrape off the remaining plasticbody 150 within the runner area 122.

Referring to FIG. 21, part of the plastic body 150 filled within thevoid area 130 is removed in a fourth step. That is, part of the plasticbody 150 filled within the two first through grooves 132 (e.g., theresidual material 151 at the four corners as shown in FIG. 20) isremoved. After the third and the fourth steps, the remaining plasticbody 150 that is not removed forms the housing 111 of the carrierleadframe 100″.

Referring to FIG. 22, the part of the extending portion 140 exposedoutside the plastic body 150 (as shown in FIG. 21) is removed in a fifthstep so that the remaining extending portion 140 is separated from theframe body 120. In other words, the part of the extending portion 140 atthe two sides of the second through groove 133 will be removed in thisstep so that the second through groove 133 is in communication with thefirst through groove 132. The remaining extending portion 140 forms theelectrode portions 112 of the carrier leadframe 100″.

After the aforesaid steps, the carrier leadframe 100″ is formed. Itshall be noted that, the order in which the third step to the fifth stepare executed is not limited, but can be swapped with each other.

The above description is related to the detailed technical contents andinventive features thereof. People skilled in this field may proceedwith a variety of modifications and replacements based on thedescription and suggestions of the present disclosure as describedwithout departing from the characteristics thereof. Nevertheless,although such modifications and replacements are not fully disclosed inthe above descriptions, they have substantially been covered in thefollowing claims as appended.

What is claimed is:
 1. A method of manufacturing a light emittingdevice, the method comprising: providing a frame body comprising atleast one void area and at least one extending portion; molding a resincontaining a reflecting material into a part of the at least one voidarea to form at least one carrier, wherein the at least one carriercomprises a housing and at least one residual material and the housingcovers a part of the at least one extending portion; removing a part ofthe at least one residual material and a part of the at least oneextending portion to form at least one housing cross section and atleast one electrode portion cross section, and wherein the at least onehousing cross section or the at least one electrode portion crosssection comprises at least one curved surface.
 2. The method accordingto claim 1, wherein the residual materials are located in the vicinityof four corners of all of the carriers.
 3. The method according to claim1, wherein at least two electrode portions are formed in the at leastone carrier after the removing step.
 4. The method according to claim 3,wherein the at least two electrode portions are spaced apart from eachother and serve respectively as an anode terminal and a cathodeterminal.
 5. The method according to claim 4, wherein the at least twoelectrode portions each comprise a wing portion that extends outside thehousing.
 6. The method according to claim 5, wherein each wing portioncomprises a central area and two outer edge areas.
 7. The methodaccording to claim 6, wherein the two outer edge areas are located atthe end side of the central area.
 8. The method according to claim 7,wherein the central area is not level with the two outer edge areas. 9.The method according to claim 7, wherein the two edge areas protrudefrom the central area.
 10. The method according to claim 9, wherein thetwo edge areas comprise two curved surfaces.
 11. The method according toclaim 10, wherein the housing covers part of the at least one supportingportions.
 12. The method according to claim 9, wherein the supportingportion extends toward one of the two electrode portions, withoutcontacting the electrode portions.
 13. The method according to claim 1,wherein a frame body further comprises at least one supporting portion,and the at least one carrier is mechanically engaged with the frame bodyvia the supporting portion.
 14. A method of manufacturing a lightemitting device, the method comprising: providing a frame bodycomprising at least one void area, at least one extending portion and atleast one supporting portion; molding a resin containing a reflectingmaterial into a part of the at least one void area to form at least onecarrier, wherein the at least one carrier comprises at least one housingand at least one residual material and the housing covers a part of theat least one extending portion and a part of the at least one supportingportion; removing a part of the at least one residual material and apart of the at least one extending portion to form at least oneelectrode portion to form at least one electrode portion, wherein the atleast one electrode portion comprises at least one electrode portioncross section, and wherein at least one electrode portion cross sectioncomprises at least one curved surface.
 15. The method according to claim14, wherein the at least two supporting portions are located at twosides of the at least one electrode portion respectively.
 16. The methodaccording to claim 15, wherein the at least one housing covers a part ofthe at least one extending portion and a part of the at least oneelectrode portion.
 17. The method according to claim 16, wherein the atleast one carrier is mechanically engaged with the frame body via the atleast one supporting portion.
 18. The method according to claim 17,wherein the at least one housing is mechanically engaged with the framebody via at least four supporting portions located in the vicinity ofthe four corners of the at least one carrier.
 19. The method accordingto claim 18, wherein at least one void area, at least one extendingportion and at least one supporting portion are made through a stampingprocess.
 20. The method according to claim 19, wherein the at least oneresidual material is located in the vicinity of at least one corner ofthe at least one carrier.
 21. The method according to claim 20, whereina part of the at least one residual material is removed with a part ofthe at least one extending portion during the removing step.
 22. Themethod according to claim 21, wherein the at least one electrode portioncomprises at least two curved surfaces.